ZM-STC8 THERMAL PASTE, 1G

$6.99

 

Super Conducting Thermal Compound

– Excellent Thermal Conductivity
– Micro-Filler Density
– Measuring Graduations for Convenience
– Particle Surface Treatment Technology
– RoHS Eco-Friendly Certified
– Excellent Stability

SKU: ZM-STC8 Category: Tags: , , ,

Description

ZM-STC8 THERMAL PASTE, 1G

ZM_STC8-Thermal-Paste-1G

  • Excellent Stability: STC8 thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity: 8.3 W/m-k.
  • Measuring Graduation: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
  • Optimal Viscosity: Particle size technology provides optimal filler density to conveniently use on any type of computer chips. 350-480 Pa.s.
  • Easy to Use and Store: Syringe style is easy to use and rubber-cap prevents liquid content from being hardened over a period of time if reusing is needed.
  • Outstanding Durability: Fine micro particles fill up space between the heatsink and CPU to maximize cooling performance & RoHS Certified.

ZM_STC8-Thermal-Paste-1G

Model ZM-STC8
Dimensions 66(W) x 19(L) x 12(H)mm
Materials Silicone Dioxid, Aluminum Oxid, Zinc Oxide
Volume/Net Weight 1.5g
Color Gray
Thermal Conductivity 8.3 W/mK
Viscosity 350~480 Pa.s
Operation Temperature -40~200℃

ZM_STC8-Thermal-Paste-1G

Additional information

Weight 1 lbs
Dimensions 4 × 6 × 4 in