ZM-STC8 THERMAL PASTE, 1G
- Excellent Stability: STC8 thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity: 8.3 W/m-k.
- Measuring Graduation: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
- Optimal Viscosity: Particle size technology provides optimal filler density to conveniently use on any type of computer chips. 350-480 Pa.s.
- Easy to Use and Store: Syringe style is easy to use and rubber-cap prevents liquid content from being hardened over a period of time if reusing is needed.
- Outstanding Durability: Fine micro particles fill up space between the heatsink and CPU to maximize cooling performance & RoHS Certified.
|66(W) x 19(L) x 12(H)mm
|Silicone Dioxid, Aluminum Oxid, Zinc Oxide